Photovoltaic Materials
Our products and expertise help customers reduce silicon costs, deposition weight, breakage and floor space requirements while increasing performance and throughput. Ferro regularly presents technical papers at international PV conferences. For product data sheets, click on the links below.
Thick Film Material Systems for Crystalline Silicon Solar Cells
Front surface metallization materials
Back surface metallization materials
Screen-printable diffusion solutions
Aluminum BSF paste
Thick film materials for thin film and other solar applications
Innovations Make Solar More Cost.Competitive
Lead-free silver and aluminum materials meet emerging EU regulations
All materials are cadmiun-free
Front and rear silver Hot Melt formulations
Front silver contacts optimized for silicon nitride ARC and textured wafers
Low Bow aluminum BSF for thin silicon wafers
Following Data Sheets are in PDF format
Front surface metallizations - Thick Film Silver Conductor Inks
33-462 Inks designed for SiN ARCs
NS 33-501 Inks designed for SiN & TIO2 ARCs
NS 33-502 Inks designed for SiN ARCs
NS 33-503 Inks designed for SiN ARCs
NS 33-551 Hot Melt Inks designed for SiN & TIO2 ARCs
NS 33-552 Hot Melt Inks designed for SiN ARCs
NS 33-553 Hot Melt Inks designed for SiN ARCs
Diffusion sources
99-001 Diffusion Barrier
99-033 Boron
99-038 Phosphorus
99-051 Edge Isolation
Ag, Ag/Al back surface metallizations - Silver/Aluminum, Silver Back Surface Thick Film Conductor Inks
3398 Ag/Al
33-466 Lead Free Rear Silver
PS 33-600 Lead Free Rear Silver
PS 33-601 Lead Free Rear Ag/Al
PS 33-602 High Adhension Rear Ag
PS 33-650 Hot Melt Lead Free Rear Ag
PS 33-651 Hot Melt Lead Free Rear Ag/Al
PS 33-652 Hot Melt High Adhesion Rear Ag
Al back surface metallizations - Aluminum Back Surface Thick Film Conductor Inks
AL 53-090 High Adhesion
AL 53-110 Thin Wafer, Lead Free
AL 53-120-Series Al/B Thin Wafer, Lead Free
AL 53-130 SiN ARCs, Lead Free
AL 53-131 SiNx ARCs, FireThrough
Lead-free Materials Meeting Emerging EU Regulations
33-466 Lead Free Rear Silver
PS 33-600 Lead Free Rear Silver
PS 33-601 Lead Free Rear Silver/Aluminum
PS 33-650 Hot Melt Lead Free Rear Silver
PS 33-651 Hot Melt Lead Free Aluminum Back Surface Metallization
AL 53-110 Thin Wafer, Lead Free Aluminum Back Surface Metallization
AL 53-120-Series Thin Wafer, Lead Free Aluminum/Boron Back Surface Metallization
AL 53-130 Lead Free Aluminum Back Surface Metallization for Sin ARCs
LF 33-701 Lead Free Silver Conductor for Thin Film & Interconnect
Hot Melt Silver Condutor Inks
NS 33-551 Hot Melt inks designed for SiN & TIO2 ARCs
NS 33-552 Hot Melt inks designed for SiN ARCs
NS 33-553 Hot Melt inks designed for SiN ARCs
PS 33-650 Hot Melt Lead Free Rear Ag
PS 33-651 Hot Melt Lead Free Rear Silver/Aluminum
PS 33-652 Hot Melt High Adhesion Rear Ag
Thin Film & Interconnect Materials
LF33-700 Low Temperature Silver Conductor
LF33-701 Low Temperature Lead Free Silver Conductor
LF33-750 Low Temperature Silver Polymer Silver Conductor
Legacy Products
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